Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...

AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.

Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...

DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...

Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...

ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...

SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies ... SEMICON Japan opens at Tokyo Big ...

The Arm vs. Qualcomm trial has concluded with closing arguments, leaving the jury to deliberate. TIRIAS Research analysts Jim McGregor and Francis Sideco explore case insights and implications, ...

Samsung and Texas Instruments secured billions in US government support under the CHIPS Act to boost domestic semiconductor production. Samsung will receive $4.75 billion, while Texas Instruments gets ...

The semiconductor industry is advancing with cutting-edge packaging technologies like 2.5D/3D, Chiplet, and FOWLP, delivering superior performance and integration. These innovations address AI, 5G, ...

Taiwan must harness its expertise in servers and chips to lead AI development, Wu Chih-yi urged at a tech conference. He stressed generative AI's dependence on advanced semiconductors and prioritized ...